Intel Packaging R&D Engineer in Phoenix, Arizona
Substrate Packaging Technology Development (SPTD) within the Assembly and Test Technology Development (ATTD) group, is looking to fill a Substrate Technology Transfer Coordinator position in the external Embedded Multi-die Interconnect Bridge (EMIB) and/or Client and/or Server team. The candidate will be interacting with substrate suppliers in Asia (China) to enable their next generation equipment and processes, partner with SPTD internal factory module engineers on tech transfer of key process building blocks and technology. The candidate will be expected to:
Become a substrate module engineering expert that can solve integrated engineering problems, involved in the supplier's material, equipment and process development to meet Intel design, product and quality and/or reliability requirements.
Hands-on participation and collaboration with SPTD internal factory module engineers on technology transfer of key process building blocks including tool qual, fingerprint, process window validation and whitepaper for changes.
Work with and lead supplier engineering team to drive continuous process, equipment, material improvements to meet Intel requirements.
Collaborate with internal customers including supplier integrators, quality and yield stakeholders to identify product requirements, and drive module level deliverables under overall program schedules.
Understand design of experiments and statistical data analysis to make data driven engineering decisions.
Be flexible working hours to support Asia business meetings and international travel to China is required for technology transfer activities.
The candidate should also exhibit the following behavioral traits and/or skills:
Collaboration with internal stakeholders and customers to deliver program and organizational requirements.
Communication and presentation skills
This is an entry level position and compensation will be given accordingly
You must possess the below requirements to be initially considered for this position.
Possess a PhD degree (with 1+ years of relevant experience) or master's degree (with 6+ years of relevant experience) in Condensed Matter Physics or Materials Science and Engineering or Chemical Engineering or Organic Chemistry or Mechanical Engineering or related engineering major.
Experience in Fab and/or Substrate manufacturing process, technology such as lithography, laser, lamination, plating, etch or assembly processes.
Capability to deep dive into fundamental root cause and identify robust CA/PA.
Demonstrate expertise with process PCS and statistical data analysis
Understanding of material characterization techniques such as TOF SIMS, EDS and/or EELS, SEM and/or TEM, XPS, FTIR, HPLC, etc.
Willingness to work in cleanroom environment at SPTD and supplier sites
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.