Intel Packaging R&D Engineer in Phoenix, Arizona
Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Responsible for the thermal/mechanical/electrical pathfinding, design, analysis, and development of electronic packages and other components and assemblies such as high speed optical/electrical connectors, fibers, cables and sockets as well as successful integration to Intel's XPUs.
Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
Conducts tests and research on basic materials and properties.
Establishes material specifications for contract assemblers and vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur.
Develops solutions to problems utilizing formal education and judgment.
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Ph.D. or Masters with 5+ years in Mechanical, Materials, Chemical, Electrical Engineering
Demonstrated technical competency, problem solving.
Background in silicon photonics, systems engineering, hardware design and manufacturing and knowledge of High speed I/O signaling, and, Flip chip assembly, process development is helpful.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.